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Diffusion bonding of 410 stainless steel to copper using a nickel interlayer
H. Sabetghadam, A. Zarei Hanzaki, A. AraeeVolume:
61
Year:
2010
Language:
english
Pages:
9
DOI:
10.1016/j.matchar.2010.03.006
File:
PDF, 2.29 MB
english, 2010