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Microstructural characterization and mechanical property of active soldering anodized 6061 Al alloy using Sn–3.5Ag–xTi active solders
Wei-Lin Wang, Yi-Chia TsaiVolume:
68
Year:
2012
Language:
english
Pages:
7
DOI:
10.1016/j.matchar.2012.03.007
File:
PDF, 1.35 MB
english, 2012