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Electrochemical–mechanical planarization of copper: Effects of chemical additives on voltage controlled removal of surface layers in electrolytes
P.C. Goonetilleke, D. RoyVolume:
94
Year:
2005
Language:
english
Pages:
13
DOI:
10.1016/j.matchemphys.2005.05.020
File:
PDF, 372 KB
english, 2005