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Effect of temperature on microstructural changes of the Sn–9 wt.% Zn lead-free solder stripe under current stressing
Chih-ming Chen, Yu-min Hung, Chi-pu Lin, Wen-Chiung SuVolume:
115
Year:
2009
Language:
english
Pages:
4
DOI:
10.1016/j.matchemphys.2008.12.019
File:
PDF, 1.09 MB
english, 2009