Effect of P and aging on microstructure and shear strength of Sn–2.5Ag–2.0Ni/Ni(P) solder joints
Mao Wu, Xinbo He, Rafi-ud-din, Shubin Ren, Mingli Qin, Xuanhui QuVolume:
121
Year:
2010
Language:
english
Pages:
8
DOI:
10.1016/j.matchemphys.2010.01.030
File:
PDF, 2.11 MB
english, 2010