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Superconformal filling of 41 nm trenches with Cu electroless deposition on Au-activated self-assembled monolayer
W.K. Han, G.H. Hwang, S.J. Hong, H.H. An, C.S. Yoon, J.H. Kim, M.J. Lee, G. Hong, K.S. Park, S.G. KangVolume:
123
Year:
2010
Language:
english
Pages:
6
DOI:
10.1016/j.matchemphys.2010.04.029
File:
PDF, 533 KB
english, 2010