Precipitation of large Ag3Sn intermetallic compounds in SnAg2.5 microbumps after multiple reflows in 3D-IC packaging
Ruo-Wei Yang, Yuan-Wei Chang, Wei-Chi Sung, Chih ChenVolume:
134
Year:
2012
Language:
english
Pages:
5
DOI:
10.1016/j.matchemphys.2012.02.074
File:
PDF, 786 KB
english, 2012