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Microstructure design and dissolution behavior between 2024 Al/Sn with the ultrasonic-associated soldering
Yuanxing Li, Xuesong Leng, Sheng Cheng, Jiuchun YanVolume:
40
Année:
2012
Langue:
english
Pages:
6
DOI:
10.1016/j.matdes.2012.04.002
Fichier:
PDF, 1.31 MB
english, 2012