Current stressing-induced growth of Cu3Sn in Cu/Sn/Cu...

Materials Letters 2011 Vol. 65; Iss. 9

Current stressing-induced growth of Cu3Sn in Cu/Sn/Cu solder joints

Delphic Chen, Cheng-En Ho, Jui-Chao Kuo
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
65
Year:
2011
Language:
english
Pages:
4
DOI:
10.1016/j.matlet.2011.01.048
File:
PDF, 1.56 MB
english, 2011
Conversion to is in progress
Conversion to is failed