Suppressing Ni3Sn4 formation in the Sn–Ag–Cu solder joints...

Materials Letters 2011 Vol. 65; Iss. 21-22

Suppressing Ni3Sn4 formation in the Sn–Ag–Cu solder joints with Ni–P/Pd/Au surface finish

Chien-Fu Tseng, Tae-Kyu Lee, Gnyaneshwar Ramakrishna, Kuo-Chuan Liu, Jenq-Gong Duh
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Volume:
65
Year:
2011
Language:
english
Pages:
3
DOI:
10.1016/j.matlet.2011.07.015
File:
PDF, 836 KB
english, 2011
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