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Processing and moisture effects on TDDB for Cu/ULK BEOL structures
E.G. Liniger, T.M. Shaw, S.A. Cohen, P.K. Leung, S.M. Gates, G. Bonilla, D.F. Canaperi, S. Papa RaoVolume:
92
Year:
2012
Language:
english
Pages:
4
DOI:
10.1016/j.mee.2010.10.037
File:
PDF, 403 KB
english, 2012