Golden bump for 20 micron diameter wire bond...

Microelectronic Engineering 2011 Vol. 88; Iss. 9

Golden bump for 20 micron diameter wire bond enhancement at reduced process temperature

Chunyan Nan, Michael Mayer, Norman Zhou, John Persic
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Volume:
88
Year:
2011
Language:
english
Pages:
6
DOI:
10.1016/j.mee.2011.05.001
File:
PDF, 929 KB
english, 2011
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