Wafer-level three-dimensional integrated circuits (3D IC):...

Microelectronic Engineering 2011 Vol. 88; Iss. 11

Wafer-level three-dimensional integrated circuits (3D IC): Schemes and key technologies

Ming-Fang Lai, Shih-Wei Li, Jian-Yu Shih, Kuan-Neng Chen
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Volume:
88
Year:
2011
Language:
english
Pages:
5
DOI:
10.1016/j.mee.2011.05.036
File:
PDF, 585 KB
english, 2011
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