A thermal–mechanical coupled finite element model with experimental temperature verification for vertically stacked FPGAs
Chunbo (Sam) Zhang, Ramachandra Kallam, Andrew Deceuster, Aravind Dasu, Leijun LiVolume:
91
Year:
2012
Language:
english
Pages:
9
DOI:
10.1016/j.mee.2011.11.011
File:
PDF, 1.29 MB
english, 2012