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Effect of additions of ZrO2 nano-particles on the microstructure and shear strength of Sn–Ag–Cu solder on Au/Ni metallized Cu pads
Asit Kumar Gain, Y.C. Chan, Winco K.C. YungVolume:
51
Year:
2011
Language:
english
Pages:
8
DOI:
10.1016/j.microrel.2011.03.042
File:
PDF, 2.56 MB
english, 2011