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3D Electro-thermal modelling of bonding and metallization ageing effects for reliability improvement of power MOSFETs
T. Azoui, P. Tounsi, Ph. Dupuy, L. Guillot, J.M. DorkelVolume:
51
Year:
2011
Language:
english
Pages:
5
DOI:
10.1016/j.microrel.2011.06.018
File:
PDF, 971 KB
english, 2011