Migration induced material transport in Cu–Sn IMC and...

Microelectronics Reliability 2011 Vol. 51; Iss. 9-11

Migration induced material transport in Cu–Sn IMC and SnAgCu microbumps

L. Meinshausen, K. Weide-Zaage, H. Frémont
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Volume:
51
Year:
2011
Language:
english
Pages:
5
DOI:
10.1016/j.microrel.2011.06.032
File:
PDF, 731 KB
english, 2011
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