Measurement and simulation of interfacial adhesion strength...

Microelectronics Reliability 2011 Vol. 51; Iss. 9-11

Measurement and simulation of interfacial adhesion strength between SiO2 thin film and III–V material

Tsung-Lin Chou, Shin-Yueh Yang, Chung-Jung Wu, Cheng-Nan Han, Kou-Ning Chiang
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Volume:
51
Year:
2011
Language:
english
Pages:
5
DOI:
10.1016/j.microrel.2011.06.045
File:
PDF, 1.17 MB
english, 2011
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