Vertical InGaN light-emitting diodes with Ag paste as...

Microelectronics Reliability 2012 Vol. 52; Iss. 5

Vertical InGaN light-emitting diodes with Ag paste as bonding layer

Y.C. Yang, Jinn-Kong Sheu, Ming-Lun Lee, Che-Kang Hsu, Shang-Ju Tu, Shu-Yen Liu, C.C. Yang, Feng-Wen Huang
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Volume:
52
Year:
2012
Language:
english
Pages:
3
DOI:
10.1016/j.microrel.2011.06.067
File:
PDF, 402 KB
english, 2012
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