Influence of air gaps on the thermal–electrical–mechanical...

Microelectronics Reliability 2011 Vol. 51; Iss. 9-11

Influence of air gaps on the thermal–electrical–mechanical behavior of a copper metallization

Irina Bauer, Kirsten Weide-Zaage, Lutz Meinshausen
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Volume:
51
Year:
2011
Language:
english
Pages:
5
DOI:
10.1016/j.microrel.2011.07.011
File:
PDF, 724 KB
english, 2011
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