Comparison of IGBT short-circuit failure “ohmic mode”: Epoxy molded package versus silicone gel module for new fail-safe and interruptible power converters
Frédéric Richardeau, Zhifeng Dou, Emmanuel Sarraute, Jean-Marc Blaquiere, Didier FlumianVolume:
51
Year:
2011
Language:
english
Pages:
8
DOI:
10.1016/j.microrel.2011.07.031
File:
PDF, 3.82 MB
english, 2011