Comparative studies on solder joint reliability of CTBGA...

Comparative studies on solder joint reliability of CTBGA assemblies with various adhesives using the array-based package shear test

Hongbin Shi, Toshitsugu Ueda
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
51
Year:
2011
Language:
english
Pages:
5
DOI:
10.1016/j.microrel.2011.07.034
File:
PDF, 927 KB
english, 2011
Conversion to is in progress
Conversion to is failed