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Comparative studies on solder joint reliability of CTBGA assemblies with various adhesives using the array-based package shear test
Hongbin Shi, Toshitsugu UedaVolume:
51
Year:
2011
Language:
english
Pages:
5
DOI:
10.1016/j.microrel.2011.07.034
File:
PDF, 927 KB
english, 2011