Low-temperature low-pressure die attach with hybrid silver...

Microelectronics Reliability 2012 Vol. 52; Iss. 2

Low-temperature low-pressure die attach with hybrid silver particle paste

K. Suganuma, S. Sakamoto, N. Kagami, D. Wakuda, K.-S. Kim, M. Nogi
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Volume:
52
Year:
2012
Language:
english
Pages:
6
DOI:
10.1016/j.microrel.2011.07.088
File:
PDF, 998 KB
english, 2012
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