Chip and package-related degradation of high power white...

Microelectronics Reliability 2012 Vol. 52; Iss. 5

Chip and package-related degradation of high power white LEDs

Matteo Meneghini, Matteo Dal Lago, Nicola Trivellin, Giovanna Mura, Massimo Vanzi, Gaudenzio Meneghesso, Enrico Zanoni
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Volume:
52
Year:
2012
Language:
english
Pages:
9
DOI:
10.1016/j.microrel.2011.07.091
File:
PDF, 1.09 MB
english, 2012
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