Microstructure and mechanical properties of Sn–Zn–Bi–Cr...

Microelectronics Reliability 2012 Vol. 52; Iss. 3

Microstructure and mechanical properties of Sn–Zn–Bi–Cr lead-free solder

Tingbi Luo, Anmin Hu, Jing Hu, Ming Li, Dali Mao
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
52
Year:
2012
Language:
english
Pages:
4
DOI:
10.1016/j.microrel.2011.10.005
File:
PDF, 925 KB
english, 2012
Conversion to is in progress
Conversion to is failed