Development of SnAg-based lead free solders in electronics...

Microelectronics Reliability 2012 Vol. 52; Iss. 3

Development of SnAg-based lead free solders in electronics packaging

Liang Zhang, Cheng-wen He, Yong-huan Guo, Ji-guang Han, Yong-wei Zhang, Xu-yan Wang
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Volume:
52
Year:
2012
Language:
english
Pages:
20
DOI:
10.1016/j.microrel.2011.10.006
File:
PDF, 2.58 MB
english, 2012
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