A novel decapsulation technique for failure analysis of...

Microelectronics Reliability 2012 Vol. 52; Iss. 4

A novel decapsulation technique for failure analysis of epoxy molded IC packages with Cu wire bonds

Chien-Pan Liu, Yen-Fu Liu, Chang-Hung Li, Hung-Chieh Cheng, Yi-Chun Kung, Jeng-Yu Lin
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Volume:
52
Year:
2012
Language:
english
Pages:
10
DOI:
10.1016/j.microrel.2011.11.005
File:
PDF, 3.01 MB
english, 2012
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