Chip warpage model for reliability prediction of...

Chip warpage model for reliability prediction of delamination failures

Se Young Yang, Woon-Seong Kwon, Soon-Bok Lee
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Volume:
52
Year:
2012
Language:
english
Pages:
7
DOI:
10.1016/j.microrel.2011.11.013
File:
PDF, 1.51 MB
english, 2012
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