![](/img/cover-not-exists.png)
Improvement of microstructure and interface structure of eutectic Sn–0.7Cu solder with small amount of Zn addition
Fengjiang Wang, Xin Ma, Yiyu QianVolume:
53
Year:
2005
Language:
english
Pages:
4
DOI:
10.1016/j.scriptamat.2005.05.013
File:
PDF, 283 KB
english, 2005