The growth of Sn whiskers with dislocation inclusion upon...

Scripta Materialia 2009 Vol. 60; Iss. 12

The growth of Sn whiskers with dislocation inclusion upon electromigration through a Cu/Sn3.5Ag/Au solder joint

Tsung-Chieh Chiu, Kwang-Lung Lin
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Volume:
60
Year:
2009
Language:
english
Pages:
4
DOI:
10.1016/j.scriptamat.2009.02.061
File:
PDF, 267 KB
english, 2009
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