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New mechanisms of void growth in Au–Al wire bonds: Volumetric shrinkage and intermetallic oxidation
H. Xu, C. Liu, V.V. Silberschmidt, S.S. Pramana, T.J. White, Z. Chen, V.L. AcoffVolume:
65
Year:
2011
Language:
english
Pages:
4
DOI:
10.1016/j.scriptamat.2011.06.050
File:
PDF, 681 KB
english, 2011