Wafer-level bonding and direct electrical interconnection of stacked 3D MEMS by a hybrid low temperature process
S. Kühne, C. HieroldVolume:
172
Year:
2011
Language:
english
Pages:
6
DOI:
10.1016/j.sna.2011.04.018
File:
PDF, 1.01 MB
english, 2011