Anodic bonding of activated tin solder alloys in the liquid...

Anodic bonding of activated tin solder alloys in the liquid state: A novel large-area hermetic glass sealing method

Matthias M. Koebel, Nancy El Hawi, Jia Lu, Felix Gattiker, Jürg Neuenschwander
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Volume:
95
Year:
2011
Language:
english
Pages:
8
DOI:
10.1016/j.solmat.2011.06.012
File:
PDF, 1.10 MB
english, 2011
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