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CF4 fluorination onto Cu surface using atmospheric pressure non-equilibrium plasma for flux-less soldering with lead free solder
Masato Ueshima, Yusuke Nakamura, Shingo Horii, Kazuo SugiyamaVolume:
206
Year:
2011
Language:
english
Pages:
4
DOI:
10.1016/j.surfcoat.2011.04.030
File:
PDF, 1008 KB
english, 2011