Interfacial reaction between Sn–3.0Ag–0.5Cu liquid solder...

Surface and Coatings Technology 2011 Vol. 206; Iss. 7

Interfacial reaction between Sn–3.0Ag–0.5Cu liquid solder and Ni–xZn novel UBM layers

Hsiu-Min Lin, Jenq-Gong Duh
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Volume:
206
Year:
2011
Language:
english
Pages:
6
DOI:
10.1016/j.surfcoat.2011.08.055
File:
PDF, 2.22 MB
english, 2011
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