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Role of additives in electroless copper plating using hypophosphite as reducing agent
Xueping Gan, Kechao Zhou, Wenbin Hu, Dou ZhangVolume:
206
Year:
2012
Language:
english
Pages:
5
DOI:
10.1016/j.surfcoat.2012.02.006
File:
PDF, 1.27 MB
english, 2012