Adhesion studies of GaAs-based ohmic contact and bond pad metallization
P.K. Seigal, R.D. Briggs, D.J. Rieger, A.G. Baca, A.J. HowardVolume:
290-291
Year:
1996
Language:
english
Pages:
5
DOI:
10.1016/s0040-6090(96)09021-9
File:
PDF, 303 KB
english, 1996