The addition of surfactant to slurry for polymer CMP:...

Thin Solid Films 1996 Vol. 290-291; Iss. none

The addition of surfactant to slurry for polymer CMP: effects on polymer surface, removal rate and underlying Cu

Jan M. Neirynck, G.-R. Yang, Shyam P. Murarka, Ronald J. Gutmann
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Volume:
290-291
Year:
1996
Language:
english
Pages:
6
DOI:
10.1016/s0040-6090(96)09033-5
File:
PDF, 398 KB
english, 1996
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