Diffusion barrier properties of sputtered TaNx between Cu...

Materials Chemistry and Physics 2003 Vol. 80; Iss. 3

Diffusion barrier properties of sputtered TaNx between Cu and Si using TaN as the target

Yu-Lin Kuo, Jui-Jen Huang, Shun-Tang Lin, Chiapyng Lee, Wen-Horng Lee
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Volume:
80
Year:
2003
Language:
english
Pages:
6
DOI:
10.1016/s0254-0584(03)00106-8
File:
PDF, 208 KB
english, 2003
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