![](/img/cover-not-exists.png)
Ultra-shallow junction technology for 100 nm CMOS: xR LEAP implanter and RTP-centura rapid thermal annealer
Michael I. Current, David Lopes, Majeed Foad, Wendell Boyd Jr.Volume:
54
Year:
1998
Language:
english
Pages:
4
DOI:
10.1016/s0254-0584(98)00066-2
File:
PDF, 415 KB
english, 1998