Evaluation of Ti–Si–N as a diffusion barrier between copper...

Materials Chemistry and Physics 2000 Vol. 63; Iss. 1

Evaluation of Ti–Si–N as a diffusion barrier between copper and silicon

Jin-Tae No, Jun-Hwan O, Chongmu Lee
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Volume:
63
Year:
2000
Language:
english
Pages:
6
DOI:
10.1016/s0254-0584(99)00203-5
File:
PDF, 416 KB
english, 2000
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