Co/Cu solid solution prepared by ion implantation

Journal of Magnetism and Magnetic Materials 1999 Vol. 205; Iss. 2-3

Co/Cu solid solution prepared by ion implantation

J Noetzel, A Handstein, A Mücklich, F Prokert, H Reuther, J Thomas, E Wieser, W Möller
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Volume:
205
Year:
1999
Language:
english
Pages:
7
DOI:
10.1016/s0304-8853(99)00534-x
File:
PDF, 351 KB
english, 1999
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