EMI mitigation with multilayer power-bus stacks and via...

IEEE Transactions on Electromagnetic Compatibility 2001 Vol. 43; Iss. 4

EMI mitigation with multilayer power-bus stacks and via stitching of reference planes

Xiaoning Ye, Hockanson, D.A., Min Li, Yong Ren, Wei Cui, Drewniak, J.L., DuBroff, R.E.
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Volume:
43
Year:
2001
Language:
english
Pages:
11
DOI:
10.1109/15.974633
File:
PDF, 296 KB
english, 2001
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