A novel modeling technique for efficiently computing 3-D...

IEEE Transactions on Electron Devices 1998 Vol. 45; Iss. 1

A novel modeling technique for efficiently computing 3-D capacitances of VLSI multilevel interconnections-BFEM

Hsin-Ming Hou, Chin-Shown Sheen, Ching-Yuan Wu
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Volume:
45
Year:
1998
Language:
english
Pages:
6
DOI:
10.1109/16.658831
File:
PDF, 204 KB
english, 1998
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