A novel transient simulation for 3D multilevel...

IEEE Transactions on Electron Devices 1999 Vol. 46; Iss. 4

A novel transient simulation for 3D multilevel interconnections on complex topography

Hsin-Ming Hou, Chin-Shown Sheen, Ching-Yuan Wu
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
46
Year:
1999
Language:
english
Pages:
6
DOI:
10.1109/16.753702
File:
PDF, 243 KB
english, 1999
Conversion to is in progress
Conversion to is failed