Microstructure and reliability of copper interconnects
Changsup Ryu, Kee-Won Kwon, Loke, A.L.S., Haebum Lee, Nogami, T., Dubin, V.M., Kavari, R.A., Ray, G.W., Wong, S.S.Volume:
46
Year:
1999
Language:
english
Pages:
8
DOI:
10.1109/16.766872
File:
PDF, 574 KB
english, 1999