Bond wireless multichip packaging technology for high-speed...

IEEE Transactions on Components Hybrids and Manufacturing Technology 1992 Vol. 15; Iss. 4

Bond wireless multichip packaging technology for high-speed circuits

Chen, C.-L., Mahoney, L.J., Tsang, D.Z., Molvar, K.M.
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Volume:
15
Year:
1992
Language:
english
Pages:
6
DOI:
10.1109/33.159873
File:
PDF, 772 KB
english, 1992
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