Thermal interaction of semiconductor devices on copper clad...

IEEE Transactions on Components Hybrids and Manufacturing Technology 1992 Vol. 15; Iss. 5

Thermal interaction of semiconductor devices on copper clad ceramic substrates

Hussein, M.M., Nelson, D.J., Elshabini-Riad, A.
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Volume:
15
Year:
1992
Language:
english
Pages:
7
DOI:
10.1109/33.180027
File:
PDF, 634 KB
english, 1992
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