Attachment reliability evaluation and failure analysis of thin small outline packages (TSOP's) with Alloy 42 leadframes
Noctor, D.M., Bader, F.E., Viera, A.P., Boysan, P., Golwaltar, S., Foehringer, R.Volume:
16
Year:
1993
Language:
english
Pages:
11
DOI:
10.1109/33.273698
File:
PDF, 1.08 MB
english, 1993