A scheduling system for IC packaging industry using STEP...

IEEE Transactions on Components Packaging and Manufacturing Technology Part C 1997 Vol. 20; Iss. 4

A scheduling system for IC packaging industry using STEP enabling technology

Thu-Hua Liu, Trappey, A.J.C., Fu-Wei Chan
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Volume:
20
Year:
1997
Language:
english
Pages:
12
DOI:
10.1109/3476.650954
File:
PDF, 219 KB
english, 1997
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